NUMBER,ITEM,TYPE,STATUS,COMMENTS,ANSWER1,ANSWER2,ANSWER3
1.1,Is this checklist the latest version? ,Reviews,,,YES,NO,NOT APPLICABLE
1.3,Have action items from previous reviews for Next higher and same level assemblies been reviewed? ,Reviews,,,YES,NO,NOT APPLICABLE
1.3,Will any of these action items  affect this board?     ,Reviews,,,NO,NO,NOT APPLICABLE
2.1.1 ,Which product team members are responsible for which cost areas?      ,Design Approach Cost,,,see comments,NOT APPLICABLE,NOT APPLICABLE
2.3.3,Have the risks and program impacts of delays in developing or procuring these new processes been resolved?     ,Technical Risk Assessment,,,YES,NO,NOT APPLICABLE
2.3.4,Which program-critical devices; materials; or components will be sole-sourced?,Technical Risk Assessment,,,NOT APPLICABLE,SEE COMMENTS,NONE
2.3.4,Are the sole source risks reasonable?     ,Technical Risk Assessment,,,YES,NO,NOT APPLICABLE
2.4.1,Are all the statement of work requirements addressed?     ,Compliance and Verification,,,YES,NO,NOT APPLICABLE
4.1.6,What is the status of the performance specs & test procedures?.     ,Board Testability,,,YES,NO,NOT APPLICABLE
4.1.9,If you have BGAs or boundary scan components; did you attach Boundary Scan?      ,Board Testability,,,YES,NO,NOT APPLICABLE
5.1.1 ,Have all the higher-level requirements been addressed?     ,Electrical Components,,,YES,NO,NOT APPLICABLE
5.1.2 ,Are box-level requirements and key characteristics clearly defined and traceable to those at higher-levels?     ,Electrical Components,,,YES,NO,NOT APPLICABLE
5.1.3 ,Are any unique environments involved?      ,Electrical Components,,,YES,NO,NOT APPLICABLE
5.1.4,Is the conformal coating used compatible with the environmental conditions and components selected?      ,Electrical Components,,,YES,NO,NOT APPLICABLE
5.2.1 ,Do all interfaces comply with the Interface Specification?     ,Specification Compliance,,,YES,NO,NOT APPLICABLE
5.3.1,Is the design consistent with the planning diagram (EDL; drawing tree or indenture parts list) for the higher level assembly?     ,Documentation,,,YES,NO,NOT APPLICABLE
5.3.1,Does it agree with the design for this board?     ,Documentation,,,YES,NO,NOT APPLICABLE
5.4.1,Have all parts been selected from the standard parts list (PAPL)?      ,Parts Selection; Stress; and Derating,,,YES,NO,NOT APPLICABLE
5.4.1,If not; have all Non-Standard Parts Approvals (NSPARs) been approved by parts engineering and customer with adequate justification for the intended use?     ,Parts Selection; Stress; and Derating,,,YES,NO,NOT APPLICABLE
6.1.1,Is board thickness still achievable with the number of layers routed?      ,Board Design,,,YES,NO,NOT APPLICABLE
6.2.1,Are connector mounting hole locations consistent with connector dimensions?     ,Hole Definition,,,YES,NO,NOT APPLICABLE
6.3.1,Are the critical ground plane attachments acceptable?,Grounding,,,YES,NO,NOT APPLICABLE
6.4.11,Is the trace width and thickness compatible with current and derating requirements and does it allow for etching process tolerance?     ,Artwork,,,YES,NO,NOT APPLICABLE
6.5.10,Is there adequate clearance between the conductors and the board edge/milling?     ,Clearance,,,YES,NO,NOT APPLICABLE
7.1.1,Is shrink sleeving specified for insulating leads; solder cups; component bodies; etc.?     ,Assembly Design,,,YES,NO,NOT APPLICABLE